Mfg Part Number: MD2716
NSN : 5962-01-125-2362
NIIN : 011252362
CAGE Code : 34649
Manufacturer: Intel Corporation
Item Name : Microcircuit Memory
Here at Internet For Aviation, we have MD2716 Microcircuit Memory from Intel Corporation, as well as a variety of other parts from reliable manufacturers. As the only independent distributor with a No China Sourcing policy, we go to great lengths to ensure that we source responsibly when it comes to certified standard items. If you’re in need of a specific MD2716 to aid you in your aircraft repair capabilities, simply search by NSN part number, NSN or Cage Code on our parts directory. Submit an instant RFQ and a representative will get back to you in as little as 15 minutes.
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We pride ourselves in our abilities to deliver quality superior grade aviation parts in a timely schedule. Thanks to the various supply chain locations that we have across the United States. We can execute fast shipping times that outpace our competitors. Unlike other competitors, we can promise same day shipping and delivery right to the very place you need. We’re leaders in our industry thanks to our parts streamlining process which includes quick stock and acquisition of the certified product and fast shipping. For whatever needs you have, be they Microcircuit Memory and MD2716 parts, we can procure and deliver in a schedule that fits with you! Contact us today for an immediate quote!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-125-2362 Item Description: Microcircuit Memory | 5962 | 011252362 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| MD2716 | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAT | BODY WIDTH | 0.600 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+100.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+125.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| ADAQ | BODY LENGTH | 1.285 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.175 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 633.0 MILLIWATTS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS MAXIMUM POWER SOURCE |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
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